KYS Raised More Than 500M Yuan

Recently, Suzhou Keyang Semiconductor Technology Co., Ltd. raised more than 500 million yuan, this round of financing is led by China Fortune-Tech Capital and Sunic Capital, other well-known investment institutions such as Zhenjiang State-owned Investment Holding Group, Caitong Innovation, CDH Investments, etc., and Suzhou local capitals such as Zhongxin Capital, Zhidao, Gusu Talent Phase II (Suzhou Asset Management), Kangli Junzhuo (Clivia Capital), Yuelin Venture (Suzhou Fund), Huanxiu Lake No. 1 (Suzhou High-speed Rail New Town Private Equity), Soochow Venture and so on, LongBridge Capital continues to increase investment. This round of financing will be used for the construction, continuous expansion, operation of advanced packaging project and continuous investment of related technology product research and development.

Robbia Li, Chairman and CEO of KYS, said: " We are very honored to be unanimously recognized by leading industrial capital, well-known investment institutions and some of the most influential funds in Suzhou. Through this round of capital increase, KYS has further optimized the equity structure, strengthened its financial strength, and fully stimulated and released the enthusiasm and creativity of the team, laying a solid foundation for KYS to further cultivate the field of advanced packaging.

 KYS is a local enterprise that has grown organically under the close cooperation of the market, customers and team, focusing on the advanced packaging field based on TSV technology for nearly 10 years, and has been providing professional and high-quality services to the industry's top customers, and is one of the three professional TSV manufacturers in the world. Under the new shareholding structure, the company will continue to uphold the core values of " Integrity, Innovation, Quality, Customer", focusing on the world, actively deploying new technologies and new markets, creating irreplaceable value for the industry, providing customers with better and more comprehensive services, creating a larger stage for the team, and bringing sustainable and stable returns to shareholders! ”  

To be a world-leading provider TSV, WLP solution provider

The successful completion of this round of financing not only reflects the capital market's recognition of the value of KYS, but also injects stronger impetus into the development of the enterprise. In the future, the company will be driven by technological innovation, continue to increase R&D and market investment, further integrate upstream and downstream resources of the industrial chain, promote 12-inch TSV automotive line and high-end automotive CIS packaging, Saw, Baw, F-bar and other full series of filter packaging and testing, and other 3D packaging methods, form a sensor and RF characteristic packaging and testing industry layout, and actively join hands with partners such as upstream and downstream of the industry, professional investment institutions and other partners to jointly build a new situation of localization in the semiconductor industry. Contribute to the supply chain of China's semiconductor industry!