FC/SMT
技术特点
FC Bonding、SMT/FC PCBA
技术优势
· FC Bonding
√ TCB/Fusion Bonding
√ 3μm Bonding Accuracy
√ 50μm Minimum Pitch
√ SnAu Fusion Bonding
√ C2C,C2W and C2S
· SMT/FC PCBA
√ Minimum Component Size：0.25*0.125mm
√ C2/C4 Bonding
√ 10μm Bonding Accuracy
√ 120μm Minimum Pitch
√ ＜50V ESD Rating
