Suzhou Keyang Semiconductor Technology Co., Ltd.(hereinafter referred to as KYS), is a high-tech enterprise specializing in wafer-level packaging and testing services. KYS was founded in 2010, and started to mass production in 2014. At present, the registered capital is 455.05 M yuan, the total investment exceeds 1.2bn yuan, and the total area is about 70 acres. KYS focuses on the R&D and mass production of advanced packaging and testing technology, has full-size wafer-level packaging production lines, including 4-inch, 6-inch, 8-inch and 12-inch. KYS has TSV, WLCSP, Bumping and other packaging capabilities, CIS sensor and 5G filter chip products can widely used in automotive electronics, industry, 5G communication, IoT and other fields. KYS applied for 222 patents, obtained 55 invention patents, 80 utility model patents, and 30 registered trademarks.
Don't accept the status quo.
Concentrate on things
we have determined to do.
Find a way and never say no.
Faster than our competitor.
Work as a team.
When you work, get a result.
Ask things “what problem am I solving”.
Share the work, pressure, experience
and success with the team.
Take direction enthusiastically
once a decision is reached.
KYS and all the partners (customers, suppliers, employees, shareholders, etc.) keep their promises to achieve win-win cooperation.
Every employee sticks to innovating in their respective roles and put new ideas into practice.
Our employees take quality as their own responsibility, stick to their posts, strive for excellence, and implement the quality standards to each specific work.
KYS always adheres to customer-centricity, continuously improves governance structure, and grows together with our customers.
To be a World-leading TSV, WLP solution provider
Tel: 0512-68838988-8106(Business Consulting)
Add: No. 568, Fangqiao Road, Caohu Street, Suzhou, Jiangsu, China
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