TSV
Technical Characteristics
TSV (Through Silicon Via), which makes perforations directly on the silicon substrate to achieve electrical interconnection in the vertical direction. Greatly improve the signal transmission speed and effectively reduce the signal loss.
Technical Advantages
TSV can greatly shorten the path of electrical interconnection lines, reduce transmission loss, improve product performance, and cut energy consumption;
Improve the level of integration and effectively reduce package geometric dimension and weight;
Integrate multi-function chips(such as logic, memory, RF, optoelectronics, and MEMS chips) in a single module to achieve certain system requirements.
