Fan-out
Technical Characteristics
Wafer-level Fan-out hybrid packaging technology, using TSV interposer, wafer RDL, chip-scale packaging technology and other packaging technologies mixed integration.
Technical Advantages
High packaging density，able to package chips with a large number of pins;
Capable of multi-chip heterogeneous integrated packaging, to improve the integration level;
Dew die packaging, good heat dissipation;
Using silicon substrates to effectively improve the moisture absorption problem of products and improve reliability;
Facilitates chip design and layout planning to reduce physical effects such as interference, power supply noise, and electromigration.
