RDL
Technical Characteristics
RDL (Re-Distribution Layer), which reroutes dense I/O retraces into loose areas, reducing the difficulty of subsequent packaging or surface mounting.
Technical Advantages
Reduce the design difficulty of the internal wiring of the chip;
Make full use of space, and layout more pins;
I/O contact spacing can be flexibly changed, and the bump area can be adjusted, which can reduce the stress between components and improve reliability.
