Automotive-Grade CIS Package Automotive-Grade CIS Package
Automotive-Grade BGAPLCCCLCC

Automotive-Grade BGA

Technical Characteristics

Using an organic substrate as a substrate to minimize cavity size and meet the needs of automotive-grade high reliability.

Package Structure

Wafer Size

  • 8
  • 12

Application

Used in automotive, industrial camera, machine vision and other fields.

  • Automotive

  • Industrial Camera

  • Machine Vision