MEMS Package

Technical Characteristics

MEMS packaging can not only protect the functional area of the chip, but also reduce the chip package size, shorten the process cycle and cut costs.

Package Structure

Wafer Size

  • 4
  • 6
  • 8

Application

Mainly used in automotive electronics, medical, aviation, smart wear, consumer electronics, industrial sensing and other fields.

  • Automotive Electronics

  • Medical

  • Aviation

  • Smart Wear

  • Consumer Electronics

  • Industrial Sensing