Wafer Level WLCSP Wafer Level WLCSP
TSVCaplessFan-out

TSV

Technical Characteristics

Wafer-level WLCSP TSV package has the advantages of smaller package size, shorter interconnect path, lower cost, higher output efficiency and reliability.

Package Structure

Wafer Size

  • 8
  • 12

Application

Used in mobile phone, digital, smart wear, industry, medical, automotive, Internet of Things, industrial sensing and other fields.

  • Mobile Phone

  • Digital

  • Smart Wear

  • Industry

  • Medical

  • Automotive

  • Internet of Things

  • Industrial Sensing