Wafer Level Packaging Bumping
BumpingPillar

Bumping

Technical Characteristics

Including printing bump, electroplating bump, Ball Drop and other technical solutions, generally applied with RDL technology.

Package Structure

Wafer Size

  • 4in
  • 6in
  • 8
  • 12

Application

Mainly used in RF front-End chip, memory chip, automotive electronics, image sensor, power management chip, high-speed device, optoelectronic device and other fields.

  • RF front-End Chip

  • Memory Chip

  • Automotive Electronics

  • Image Sensor

  • Power Management Chip

  • High-speed Device

  • Optoelectronic Device