DPS

Technical Characteristics

DPS (Die process service) includes AOI, CP, grinding, back labeling, cutting and taping processes. Realize the complete process of TnR from wafer to single chip, and provide turnkey solutions.

Wafer Size

  • 4
  • 6
  • 8
  • 12

Wafer Material

Silicon-based/lithium tantalate/lithium niobate/glass/composite wafers and other materials.

Equipment