RF Package WLP
Solder BumpWLP

WLP

Technical Characteristics

Using organic or inorganic materials, combined with WLP packaging technologies such as wafer bonding, lithography, RDL, TSV, bumping, etc., a proprietary designed cavity structure is formed to effectively protect the IDT or resonator region while realizing electrical interconnection.

Package Structure

Wafer Size

  • 4
  • 6
  • 8

Application

Mainly used in SAW, BAW, F-BAR packaging.

  • SAW

  • BAW

  • F-BAR