Wafer Level Packaging Pillar
BumpingPillar

Pillar

Technical Characteristics

Pillar bump package reduces the area of chips, has the characteristics of good thermal conductivity, resistance to electromigration, high pin density, and low cost.

Package Structure

Wafer Size

  • 4
  • 6
  • 8
  • 12

Application

Mainly used in consumer electronics, Internet of Things, 5G, artificial intelligence, drone and other fields.

  • Consumer Electronics

  • Internet of Things

  • 5G

  • Artificial Intelligence

  • Drone