Products & Services
Solder Bump
Technical Characteristics
Solder Bump replaces the Gold Bump process with high output efficiency, low cost and excellent reliability.
Package Structure
Wafer Size
-
4
-
6in
-
8
-
12
Application
Mainly used in SAW, BAW filters, including LT, LN, composite wafers (silicon-based LT\LN wafers), etc.
-
SAW
-
BAW
