Customized Services

Service Introduction

    • Based on the extensive TSV wafer-level packaging technology foundation and accumulation, provides various customized processes and products in the full wafer size range from 4-inch to 12-inch.
    • Process Technology Platform: wafer bonding, 2D/3D lithography, deep silicon etching, dielectric layer etching, RDL (including seed layer deposition, wafer electroplating/electroless plating, metal corrosion), laser technology, wafer coating, bumping, BGA, wafer thinning, wafer cutting, chip sorting, etc.
    • Wafer Material: silicon-based, glass, lithium tantalate, lithium niobate, composite bonding sheet, etc.

Service Process

  • R&D
    Develops original packaging technologies based on customer needs
  • Product Design 
    Integrated packaging and testing service
  • Product Development 
    Market-leading rapid development and proofing service
  • Product Certification 

    Rigorous product inspection, and reliability verification system

  • Mass Production
    Fast, reliable and safe mass production delivery

Establish a sound advanced packaging technology development and production platform, develop original packaging technologies, a develop original packaging new technologies, and provide output design, development services and fast delivery for customers' products leading the market.