Environmental Reliability Test

Items Standard Purpose Test Range

Pre-condition(PC)

JESD22-A113

After removing moisture, the chip absorbs a certain amount of water, and enters Reflow to see if the chip has delamination, popcorn effect, etc.This experiment is used to simulate the process of chips production, transportation, and board use.

All pretreatment grades (Level 1, 2, 2a, 3, 4, 5, 5a) can be tested.
Moisture Sensitivity Level (MSL)

JEDEC J-STD-020

Stress-sensitive classification of moisture-affected non-hermetic surface mount devices; determine the correct packaging, storage, and handling to avoid damage during assembly of reflow connections/ repair operations.

All humidity levels (Level 1, 2, 2a, 3, 4, 5, 5a) can be tested.
High Temperature Storage(HTST)

JESD22-A103

Evaluate the product's performance of withstanding high-temperature stresses over a long period of time.

 Temperature: 60 °C ~ 200 °C.

High Temperature Operating Life (HTOL)

JESD22-A108

Chip is under high temperature conditions, adds dynamic signals, and works for a long time to evaluate its service life.

Temperature: 60 °C ~ 200 °C.

Customers need to provide test boards.
 Temperature Shock Test (TST)

JESD22-A106

Evaluate the chip package's tolerance to extreme high and low temperature rapid transitions, biased towards wafer reliability testing.

  Temperature: -55°C~150°C.

Temperature Cycling Test (TCT)

JESD22-A104

Evaluate the chip package's tolerance to extreme high and low temperature rapid transitions.

  Temperature: -55°C~150°C.

Constant Temperature and Humidity Test (THT)

JESD22-A101

Evaluate the performance of withstanding humidity and temperature stresses over a long period of time.

Temperature: -40 °C ~ 150 °C.

Humidity: 20%RH-98%RH.

Temperature and Humidity Bias test (THB)

JESD22-A110

 Chip is under the acceleration factor of high temperature, high humidity, and a voltage is applied to verify the corrosion resistance.

Temperature: -40 °C ~ 150 °C.

Humidity: 20%RH-98%RH.

Customers need to provide test boards.

Low Temperature Storage Test (LTST)

JESD22-A119

Evaluate the performance of withstanding low-temperature stress for a long time.

 Temperature: -40°C~-10°C.

Low Temperature Operating Life (LTOL)

JESD22-A108

Chip is under low temperature conditions, adds dynamic signals, and works for a long time to evaluate its service life.

Temperature: -40 °C ~ -10 °C.

Customers need to provide test boards.

Unbiased High Accelerated Stress Test (uHAST)

JESD22-A118

Chip is under the acceleration factor of high temperature, high humidity and high pressure in a confined space to verify the corrosion resistance.

110℃, 85%RH, 122kpa/

130℃, 85%RH, 230kpa.

Bias High Accelerated Stress Test (HAST)

JESD22-A110

Chip is under the acceleration factor of high temperature, high humidity and high pressure in a confined space, and a voltage is applied to verify the resistance to electrical corrosion.

110°C, 85%RH, 22kpa/

130°C, 85%RH, 230kpa.

Customers need to provide test boards.
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Failure Analysis

Items Standard  Purpose Test Range

Optical Microscope

— —

Check the appearance of the sample, whether there are cracks, contamination, scratches, etc.

Acording to actual needs.
IV Curve

GB/T13973-2012

Measure the semiconductor parameters of the IC and compare the PIN value curve.

According to actual needs.

Microsectioning Slices

— —

Profile treatment, including sealing, grinding, polishing, gold spraying.

 Mechanical grinding and polishing of various materials.
Scanning Electron Microscope

— —

Microstructure examination, dimensional measurement of floor plans and cross-sections of various samples.

 10,000 times microscopic examination.

EDX

— —

Compositional analysis of specified microstructures, elements on the sample surface.

 Positioning analysis, conductive and non-conductive samples are acceptable.
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Other Analyses

Items Standard  Purpose Test Range

Three-point Bending

GB/T 232-2010

The product is placed on two support points, and a load is applied downward at the midpoint of the two support points to determine the flexural performance of the chip.

According to actual needs.

CVS Additive Analyzer

— —

Using cyclic voltammetry to test the concentration of organic additives in solution.

Each solution.

Atomic Absorption

Spectrophotometer

— —

Used to detect metal ion concentrations (e.g. copper, nickel, etc.)

Each solution.
UV Spectro Photometer

— —

 Rapid scanning, tracking chemical reaction processes, and detecting the focusing process of ions by violet spectroscopy at different times for compositional analysis

Each solution.
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