Wafer Level WLCSP Fan-out
TSVCaplessFan-out

Fan-out

Technical Characteristics

Increase the number of I/O pins and improve the designability of chips.

Package Structure

Wafer Size

  • 8
  • 12

Application

Used in mobile phone, digital, smart wear, industry, medical, automotive, Internet of Things, industrial sensing and other fields.

  • Mobile Phone

  • Digital

  • Smart Wear

  • Industry

  • Medical

  • Vehicle

  • Internet of Things

  • Industrial Sensing